Shenzhen

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thermal gel k=4.0
Specification: Thermal Gel K=4.0
Detail: Features Thermal conductivity 4.0W/mK Low thermal resistance Ultra thin bondline Conforming with wet out Design for low stress application Applications Automotive electronics; Comsumer electronics; Telec...

thermal gel k=5.0
Specification: Thermal Gel K=5.0
Detail: Features Thermal conductivity 5.0W/mK Low thermal resistance Ultra thin bondline Conforming with wet out Design for low stress application Applications Automotive electronics Comsumer electronics Telecom...

thermal gel k=6.0
Specification: Thermal Gel K=6.0
Detail: Features Thermal conductivity 6.0W/mK Low thermal impedance Ultra low compression force Long-term reliability Design for low stress application Applications Automotive electronics Comsumer electronics Te...

thermal gel k=8.0
Specification: Thermal Gel K=8.0
Detail: Features Thermal conductivity 8.0W/mK Wet out surface, no pump out Low compression force Conforming with wet out Ultra low stress on component Applications Automotive electronics Comsumer electronics Tel...

thermal gel k=3.2
Specification: Thermal Gel K=3.2
Detail: Features High thermal performance Low thermal resistance Ultra thin bondline Conforming with wet out Design for low stress application Applications Automotive electronics Comsumer electronics Telecommuni...

thermal pad for ev battery pack cooling
Specification: Thermal pad for EV battery pack cooling
Detail: Features Excellent compressible Conformable, low hardness designed for low stress applications Applications Motor Automotive electronics New energy vehicle battery pack Description XK-P20 is a high...

low density thermal pad for ev battery cooling k=2.0
Specification: Low density thermal pad for EV battery cooling K=2.0
Detail: Features Low density, lightweight Conformable, low hardness disigned for low stress application Fiberglass reinforced for puncture, tear and shear resistance Applications Automotive electronics New energy ...

low density thermal pad for ev battery cooling k=1.5
Specification: Low density thermal pad for EV battery cooling K=1.5
Detail: Features Low density, lightweight Conformable, low hardness disigned for low stress application Fiberglass reinforced for puncture, tear and shear resistance Applications Automotive electronics New energy ...

low density thermal pad for ev battery cooling k=1.0
Specification: Low density thermal pad for EV battery cooling K=1.0
Detail: Features Low density, lightweight Conformable, low hardness disigned for low stress application Fiberglass reinforced for puncture, tear and shear resistance Applications Automotive electronics New energy ...

thermal gap filler k=1.5
Specification: Thermal Gap Filler K=1.5
Detail: Features Thermal conductivity 1.5W/mK Conforming, ideal for delicate conponent and low stress applications Cure at room or elevated temperature 100% solid, no cure by-product Low and high temperature resistance...


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