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thermal gap filler k=2.5
Specification: Thermal Gap Filler K=2.5
Detail: Features High performance Conforming, ideal for delicate conponent and low stress applications Cure at room or elevated temperature 1:1, no cure by-product Applications Automotive electronics; Electric...

thermal gap filler k=3.0
Specification: Thermal Gap Filler K=3.0
Detail: Features Thermal conductivity 3.0W/mK Conforming, ideal for delicate conponent and low stress applications Cure at room or elevated temperature 1:1, no cure by-product Applications Automotive electroni...

thermal gap filler k=4.0
Specification: Thermal Gap Filler K=4.0
Detail: Features Thermal conductivity 4.0W/mK Conforming, ideal for delicate conponent and low stress applications Cure at room or elevated temperature 1:1, no cure by-product Applications Automotive electroni...

thermal gap filler k=2.0
Specification: Thermal Gap Filler K=2.0
Detail: Features Thermal conductivity 2.0W/mK Conforming, ideal for delicate conponent and low stress applications Cure at room or elevated temperature 100% solid, no cure by-product Applications Automotive electronic...

high performance thermal gap pad k=8.0
Specification: High Performance Thermal Gap Pad K=8.0
Detail: Features High thermal conductivity 8.0W/mK Low thermal impedance Good electrical insualtion Ease of handling Applications Automotive electronics Digital disk drives Telecommunications Industrial and medi...

high performance thermal gap pad k=11.0
Specification: High Performance Thermal Gap Pad K=11.0
Detail: Features Thermal conductivity 11.0W/mK Low thermal impedance Good electrical insualtion Ease of handling Applications Automotive electronics Digital disk drives Telecommunications Industrial and...

5g thermal gap pad k=6.0
Specification: 5G Thermal Gap Pad K=6.0
Detail: Features Thermal conductivity 6.0W/mK Low thermal impedance Good electrical insualtion Easeof handling Applications Automotive electronics Digital disk drives 5G Telecommunications Industrial and me...

thermal gap pad k=5.0
Specification: Thermal Gap Pad K=5.0
Detail: Features High performance Low thermal impedance Good electrical insualtion Easy assembling Applications Automotive electronics Digital disk drives Telecommunications Industrial and medical equipment...

thermal gap pad k=4.5
Specification: Thermal Gap Pad K=4.5
Detail: Features High thermal conductivity 4.5W/mK Conformable, low hardness Good electrical insulation Applications Automotive electronics Digital disk drives Telecommunications Industrial and medical equ...

silicone thermal gap pad k=3.0
Specification: Silicone Thermal Gap Pad K=3.0
Detail: Features High thermal performance Conformable, low hardness Excellent compressible Good electrical insualtion Low strain for delicate components Applications Automotive electronics Digital disk drives Te...


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