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Graphite Sheet K=160
(1)
Low density thermal
(3)
NON-SILICONE THERMAL
(3)
Phase Change Materia
(7)
Phase Change Materia
(1)
Phase Change Materia
(1)
Phase Change Materia
(1)
Phase Change Materia
(1)
Phase Change Materia
(1)
Phase Change Materia
(1)
Printable Phase Chan
(1)
SILICONE-FREE THERMA
(13)
Thermal conductive p
(1)
THERMAL GAP FILLER
(5)
Thermal Gap Filler K
(1)
Thermal Gap Filler K
(1)
Thermal Gap Filler K
(1)
Thermal Gap Filler K
(1)
THERMAL GAP PAD
(7)
THERMAL GEL
(8)
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thermal gap filler k=2.5
Specification: Thermal Gap Filler K=2.5
Detail: Features High performance Conforming, ideal for delicate conponent and low stress applications Cure at room or elevated temperature 1:1, no cure by-product Applications Automotive electronics; Electric...
32
thermal gap filler k=3.0
Specification: Thermal Gap Filler K=3.0
Detail: Features Thermal conductivity 3.0W/mK Conforming, ideal for delicate conponent and low stress applications Cure at room or elevated temperature 1:1, no cure by-product Applications Automotive electroni...
33
thermal gap filler k=4.0
Specification: Thermal Gap Filler K=4.0
Detail: Features Thermal conductivity 4.0W/mK Conforming, ideal for delicate conponent and low stress applications Cure at room or elevated temperature 1:1, no cure by-product Applications Automotive electroni...
34
two-part thermal gap filler
Specification: TWO-PART THERMAL GAP FILLER
Detail: Features Thermal conductivity 2.0W/mK Conforming, ideal for delicate conponent and low stress applications Cure at room or elevated temperature 100% solid, no cure by-product Applications Automotive electronic...
35
thermal tape xk-tn08
Specification: XK-TN08
Detail: XK-TN08 is a double sided adhesive, thermal conductive tape. it is designed for applications where strong constructural bond is reqiured. XK-TN08 provides high bond strenghth and eliminates need for mechanical fasteners.
36
non-silicone thermal pad k=2.0
Specification: Non-Silicone Thermal Pad K=2.0
Detail: Features No siloxane volatiles High thermal performance Good electrical insulation Ultra conformable Applications Optical devices Telecommunication Medical equipment Atuomotive ECU Description Th...
37
non silicone thermal pad k=6.0
Specification: Non silicone thermal pad K=6.0
Detail: Features No siloxane volatiles High thermal performance Exellent compressibility Low hardness, conformable Electrical insulation Applications Optical precision devices Telecommunication Industr...
38
non silicone thermal pad k=3.0
Specification: Non silicone thermal pad K=3.0
Detail: Features No siloxane volatiles High thermal performance Exellent compressibility Low hardness, conformable Electrical insulation Applications Optical precision devices Telecommunication Industri...
39
non silicone thermal pad k=5.0
Specification: Non silicone thermal pad K=5.0
Detail: Features No siloxane volatiles High thermal performance Exellent compressibility Low hardness, conformable Electrical insulation Applications Optical precision devices Telecommunication Industr...
40
non-silicone thermal gel k=1.5
Specification: Non-silicone thermal gel K=1.5
Detail: Features High thermal performance Low thermal resistance Ultra conforming Low stress Applications Automotive electronics Comsumer electronics Telecommunications LED Description XK-GN15 ...
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