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Graphite Sheet K=160
(1)
Low density thermal
(3)
NON-SILICONE THERMAL
(3)
Phase Change Materia
(7)
Phase Change Materia
(1)
Phase Change Materia
(1)
Phase Change Materia
(1)
Phase Change Materia
(1)
Phase Change Materia
(1)
Phase Change Materia
(1)
Printable Phase Chan
(1)
SILICONE-FREE THERMA
(13)
Thermal conductive p
(1)
THERMAL GAP FILLER
(5)
Thermal Gap Filler K
(1)
Thermal Gap Filler K
(1)
Thermal Gap Filler K
(1)
Thermal Gap Filler K
(1)
THERMAL GAP PAD
(7)
THERMAL GEL
(8)
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graphite sheet k=1600
Specification: Graphite Sheet K=1600
Detail: Features Thermal conductivity: 1600W/mK Suitable for highly integrated, highly intelligent, limited ***ce, high power consumption products High temperature resistance: 3000 centigrade Applications Telecomminucat...
2
phase change materials k=1.5
Specification: Phase Change Materials K=1.5
Detail: Features High performance Low thermal impedance Can be applied at room temperature Wet out and resists dripping after phase change Applications Power semiconductor CPU and GPU Power conversion De...
3
phase change material k=2.0
Specification: Phase Change Material K=2.0
Detail: Features High performance Low thermal impedance Can be applied at room temperature Wet out and resists dripping after phase change Applications Power semiconductor CPU and GPU Power conversion De...
4
phase change material k=3.4
Specification: Phase Change Material K=3.4
Detail: Features High performance Low thermal impedance Can be applied at room temperature Wet out and resists dripping after phase change Applications Power semiconductor CPU and GPU Power conversion De...
5
printable phase change material k=3.4
Specification: Printable Phase Change Material K=3.4
Detail: Features High performance Low thermal impedance Can be applied at room temperature Wet out and resists dripping Applications Power semiconductor CPU and GPU Power conversion Description XK-C35D is ...
6
phase change material k=2.5
Specification: Phase Change Material K=2.5
Detail: Features High performance Low thermal impedance Can be applied at room temperature Wet out and resists dripping after phase change Applications Power semiconductor CPU and GPU Power conversion De...
7
phase change material k=3.5
Specification: Phase Change Material K=3.5
Detail: Features High performance Low thermal impedance Can be applied at room temperature Wet out and resists dripping after phase change Applications Power semiconductor CPU and GPU Power conversion De...
8
phase change material k=1.6
Specification: Phase Change Material K=1.6
Detail: Features High performance Low thermal impedance Can be applied at room temperature Wet out and resists dripping after phase change Good electrical insulation Applications Power semiconductor CPU and...
9
thermal grease k=4.0
Specification: Thermal grease K=4.0
Detail: Features High performance Low silicone sxtraction Ultra thin bondline Applications Telecommunications Computer and peripherals LED Description XK-X serial product is high thermal performance, low therm...
10
thermal silicone grease k=1.0
Specification: Thermal silicone grease K=1.0
Detail: Features High performance Low silicone sxtraction Ultra thin bondline Applications Telecommunications Computer and peripherals LED Description XK-X serial product is high thermal performance, low thermal r...
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