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Graphite Sheet K=160
(1)
Low density thermal
(3)
NON-SILICONE THERMAL
(3)
Phase Change Materia
(7)
Phase Change Materia
(1)
Phase Change Materia
(1)
Phase Change Materia
(1)
Phase Change Materia
(1)
Phase Change Materia
(1)
Phase Change Materia
(1)
Printable Phase Chan
(1)
SILICONE-FREE THERMA
(13)
Thermal conductive p
(1)
THERMAL GAP FILLER
(5)
Thermal Gap Filler K
(1)
Thermal Gap Filler K
(1)
Thermal Gap Filler K
(1)
Thermal Gap Filler K
(1)
THERMAL GAP PAD
(7)
THERMAL GEL
(8)
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thermal gel k=8.0
Specification: Thermal Gel K=8.0
Detail: Features Thermal conductivity 8.0W/mK Wet out surface, no pump out Low compression force Conforming with wet out Ultra low stress on component Applications Automotive electronics Comsumer electronics Tel...
62
thermal gel k=3.2
Specification: Thermal Gel K=3.2
Detail: Features High thermal performance Low thermal resistance Ultra thin bondline Conforming with wet out Design for low stress application Applications Automotive electronics Comsumer electronics Telecommuni...
63
non-silicone thermal gel k=1.5
Specification: Non-silicone thermal gel K=1.5
Detail: Features High thermal performance Low thermal resistance Ultra conforming Low stress Applications Automotive electronics Comsumer electronics Telecommunications LED Description XK-GN15 ...
64
non-silicone thermal putty k=2.0
Specification: Non-silicone thermal putty K=2.0
Detail: Features High thermal performance Low thermal resistance Ultra conforming Low stress Applications Automotive electronics Comsumer electronics Telecommunications LED Description XK-GN20 is a ...
65
non-silicone thermal gel k=3.0
Specification: Non-silicone Thermal Gel K=3.0
Detail: Features High thermal performance Low thermal resistance Ultra conforming Low stress, non pump-out Applications Automotive electronics Comsumer electronics Telecommunications LED Description...
66
thermal gel k=3.2
Specification: Thermal Gel K=3.2
Detail: Features High thermal performance Low thermal resistance Ultra thin bondline Conforming with wet out Design for low stress application Applications Automotive electronics Comsumer electronics Telecommuni...
67
thermally conductive stuctural adhesive k=3.0
Specification: Thermally Conductive Stuctural Adhesive K=3.0
Detail: Features Thermal conductivity 3.0W/(m.K), flammability UL 94-V0 Excellent electrical insulation, bonding strength¡Ý13 *** Application temperature: -45~123¡æ, Short term: 225¡æ Fast cure with additional heat Applic...
68
thermally conductive stuctural adhesive k=1.2
Specification: Thermally Conductive Stuctural Adhesive K=1.2
Detail: Features Filling gaps between heat source and heat sink Excellent electrical insulation, bond strength¡Ý13 *** Application temperature: -45~175¡æ, Short term: 250¡æ Applications Aero***ce equipments Semiconduc...
69
thermally conductive structural adhesive k=2.0
Specification: Thermally Conductive Structural Adhesive K=2.0
Detail: Features Thermal conductivity 2.0 W/(m.K), low stress Excellent electrical insulation, bonding strength¡Ý13 *** Application temperature: -45~175¡æ, Short term: 250¡æ Applications EV Battery Cell Bond; Aero***ce e...
70
thermal gap filler k=1.5
Specification: Thermal Gap Filler K=1.5
Detail: Features Thermal conductivity 1.5W/mK Conforming, ideal for delicate conponent and low stress applications Cure at room or elevated temperature 100% solid, no cure by-product Low and high temperature resistance...
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