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phase change material k=3.4
Specification: Phase Change Material K=3.4
Detail: Features High performance Low thermal impedance Can be applied at room temperature Wet out and resists dripping after phase change Applications Power semiconductor CPU and GPU Power conversion De...

printable phase change material k=3.4
Specification: Printable Phase Change Material K=3.4
Detail: Features High performance Low thermal impedance Can be applied at room temperature Wet out and resists dripping Applications Power semiconductor CPU and GPU Power conversion Description XK-C35D is ...

phase change material k=2.5
Specification: Phase Change Material K=2.5
Detail: Features High performance Low thermal impedance Can be applied at room temperature Wet out and resists dripping after phase change Applications Power semiconductor CPU and GPU Power conversion De...

phase change material k=3.5
Specification: Phase Change Material K=3.5
Detail: Features High performance Low thermal impedance Can be applied at room temperature Wet out and resists dripping after phase change Applications Power semiconductor CPU and GPU Power conversion De...

phase change material k=1.6
Specification: Phase Change Material K=1.6
Detail: Features High performance Low thermal impedance Can be applied at room temperature Wet out and resists dripping after phase change Good electrical insulation Applications Power semiconductor CPU and...

thermal gel k=1.5
Specification: Thermal Gel K=1.5
Detail: Features High thermal performance Low thermal resistance Ultra thin bondline Conforming with wet out Design for low stress application Applications Automotive electronics Comsumer electronics Teleco...

thermal gel k=2.0
Specification: Thermal gel k=2.0
Detail: Features High thermal performance Low thermal resistance Ultra thin bondline Conforming with wet out Design for low stress application Applications Automotive electronics Comsumer electronics Teleco...

thermal gel k=4.0
Specification: Thermal Gel K=4.0
Detail: Features Thermal conductivity 4.0W/mK Low thermal resistance Ultra thin bondline Conforming with wet out Design for low stress application Applications Automotive electronics; Comsumer electronics; Telec...

thermal gel k=5.0
Specification: Thermal Gel K=5.0
Detail: Features Thermal conductivity 5.0W/mK Low thermal resistance Ultra thin bondline Conforming with wet out Design for low stress application Applications Automotive electronics Comsumer electronics Telecom...

thermal gel k=6.0
Specification: Thermal Gel K=6.0
Detail: Features Thermal conductivity 6.0W/mK Low thermal impedance Ultra low compression force Long-term reliability Design for low stress application Applications Automotive electronics Comsumer electronics Te...


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