 |
|
|
| |
|
|
|
|
|
|
- (1)
- (3)
- (3)
- (7)
- (1)
- (1)
- (1)
- (1)
- (1)
- (1)
- (1)
- (13)
- (1)
- (5)
- (1)
- (1)
- (1)
- (1)
- (7)
- (8)
|
|
| |
|
|
Build Your Online Product Catalogs?
| Product Name: |
Thermal Gel K=1.5
|
| Supply Ability: |
1 |
| Related proudcts |
thermal gel, thermal gel k=1.5, |
| Specifications |
Thermal Gel K=1.5 |
| Price Term: |
FOB |
| Port of loading: |
SHENZHEN /HONGKONG |
| Minimum Order |
1000 |
| Unit Price: |
Negotiated |
|
Features
High thermal performance
Low thermal resistance
Ultra thin bondline
Conforming with wet out
Design for low stress application
Applications
Automotive electronics
Comsumer electronics
Telecommunications
Computer and peripherals
Description
XK-G15 provides low thermal impedance and ultra thin bondline thickness, improving heat transfer. It is designed to eliminate hand assembly time consuming, decreasing installation cost, it requires no curing and accommodates a variety of bondline thickness, providing superior design flexibility. |
| Company: |
Shenzhen
|
| Contact: |
Mr. Oscar Lee |
| Address: |
Rm616-619 Huafeng xin'an Commercial Building ,Block 45 ,Bao'an District, Shenzhen,China |
| Postcode: |
518000 |
| Tel: |
8615989474551 |
| Fax: |
8675527579350 |
| E-mail: |
|
|
|
Home
