86exporter.com
Home
Products Catalog
Suppliers Catalog
Log In
Sign up
About Us
Profile
Products
Graphite Sheet K=160
(1)
Low density thermal
(3)
NON-SILICONE THERMAL
(3)
Phase Change Materia
(7)
Phase Change Materia
(1)
Phase Change Materia
(1)
Phase Change Materia
(1)
Phase Change Materia
(1)
Phase Change Materia
(1)
Phase Change Materia
(1)
Printable Phase Chan
(1)
SILICONE-FREE THERMA
(13)
Thermal conductive p
(1)
THERMAL GAP FILLER
(5)
Thermal Gap Filler K
(1)
Thermal Gap Filler K
(1)
Thermal Gap Filler K
(1)
Thermal Gap Filler K
(1)
THERMAL GAP PAD
(7)
THERMAL GEL
(8)
Contact Us
Shenzhen
All Products
>>
THERMAL GEL
Showing 1 - 8 of 8, total 1 pages [First] [Previous] [Next] [Last]
1
thermal gel k=1.5
Specification: Thermal Gel K=1.5
Detail: Features High thermal performance Low thermal resistance Ultra thin bondline Conforming with wet out Design for low stress application Applications Automotive electronics Comsumer electronics Teleco...
2
thermal gel k=2.0
Specification: Thermal gel k=2.0
Detail: Features High thermal performance Low thermal resistance Ultra thin bondline Conforming with wet out Design for low stress application Applications Automotive electronics Comsumer electronics Teleco...
3
thermal gel k=4.0
Specification: Thermal Gel K=4.0
Detail: Features Thermal conductivity 4.0W/mK Low thermal resistance Ultra thin bondline Conforming with wet out Design for low stress application Applications Automotive electronics; Comsumer electronics; Telec...
4
thermal gel k=5.0
Specification: Thermal Gel K=5.0
Detail: Features Thermal conductivity 5.0W/mK Low thermal resistance Ultra thin bondline Conforming with wet out Design for low stress application Applications Automotive electronics Comsumer electronics Telecom...
5
thermal gel k=6.0
Specification: Thermal Gel K=6.0
Detail: Features Thermal conductivity 6.0W/mK Low thermal impedance Ultra low compression force Long-term reliability Design for low stress application Applications Automotive electronics Comsumer electronics Te...
6
thermal gel k=8.0
Specification: Thermal Gel K=8.0
Detail: Features Thermal conductivity 8.0W/mK Wet out surface, no pump out Low compression force Conforming with wet out Ultra low stress on component Applications Automotive electronics Comsumer electronics Tel...
7
thermal gel k=3.2
Specification: Thermal Gel K=3.2
Detail: Features High thermal performance Low thermal resistance Ultra thin bondline Conforming with wet out Design for low stress application Applications Automotive electronics Comsumer electronics Telecommuni...
8
thermal gel k=3.2
Specification: Thermal Gel K=3.2
Detail: Features High thermal performance Low thermal resistance Ultra thin bondline Conforming with wet out Design for low stress application Applications Automotive electronics Comsumer electronics Telecommuni...
Showing 1 - 8 of 8, total 1 pages [First] [Previous] [Next] [Last]
1
Copyright© Shenzhen All Rights Reserved.
Tel : 8615989474551 Fax : 8675527579350
Powered by
86exporter.com