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Build Your Online Product Catalogs?
| Product Name: |
Thermal Gap Filler K=2.5
|
| Supply Ability: |
9999999999999 |
| Related proudcts |
|
| Specifications |
Thermal Gap Filler K=2.5 |
| Price Term: |
FOB |
| Port of loading: |
Shenzhen /Hongkong |
| Minimum Order |
3000 |
| Unit Price: |
Negotiated |
|
Features
High performance
Conforming, ideal for delicate conponent
and low stress applications
Cure at room or elevated temperature
1:1, no cure by-product
Applications
Automotive electronics;
Electric vehicle battery pack;
Computer and peripherals;
Between any heat-generating
semiconductor and a heat sink;
XK-S25 is a high performance, thermally conductive, eletrically insulation gap filling material. It is ideal for fragile part with low or no stress on compnent. It cures at room or elevated temperature. after curing, it forms elastomer for easy maintenance. It suitable for filling variety of different gap thickness with low compressive forces.
Description
GLPOLY Thermal gap filler has been applied to drivers, keeping devices performing at their best .
On the market, there is a range of thermal gap fillers. But the quality of products varies considerably, you will feel that it¡¯s not easy to purchase a suitable thermal gap filler to improve thermal management of your electronic devices. Here is a case I experienced last year.
Mr. Wang was the purchasing manager from a driver manufacturing co***ny, he used to purchase Gap Filler 2000 as thermal interface material for driver products. Last year, customer wanted to change material due to COVID-19 epidemic leading to rise in price of raw material and logistics delay, he wished to cooperate with a local supplier for reducing cost and logistics complexity.
He said he had tested several samples for different suppliers, but was not satisfied with test results either high viscosity or poor performance. we knew that if we achieved a higher performance, more thermally conductive fillers was needed thus increasing the viscosity causing dispensing difficulty. If they made dispensing process more smoothly, they needed to fill less thermally conductive fillers thus decreasing thermal performance. To competing against gap filler 2000, GLPOLY has launched a thermal gap filler-XK-S25 with 2.5W/mk of thermal conductivit. The 2 |
| Company: |
Shenzhen
|
| Contact: |
Mr. Oscar Lee |
| Address: |
Rm616-619 Huafeng xin'an Commercial Building ,Block 45 ,Bao'an District, Shenzhen,China |
| Postcode: |
518000 |
| Tel: |
8615989474551 |
| Fax: |
8675527579350 |
| E-mail: |
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