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Build Your Online Product Catalogs?
| Product Name: |
Thermal Gap Filler K=1.5
|
| Supply Ability: |
9999999999999 |
| Related proudcts |
filler, gap filler, thermal gap filler, |
| Specifications |
Thermal Gap Filler K=1.5 |
| Price Term: |
FOB |
| Port of loading: |
Shenzhen /Hongkong |
| Minimum Order |
3000 |
| Unit Price: |
Negotiated |
|
Features
Thermal conductivity 1.5W/mK
Conforming, ideal for delicate conponent
and low stress applications
Cure at room or elevated temperature
100% solid, no cure by-product
Low and high temperature resistance
Applications
Automotive electronics;
Electric vehicle battery pack;
Computer and peripherals;
Between any heat-generating
semiconductor and a heat sink;
XK-S15 thermal gap filler exhibits low modulus properties and cures to a soft elastomer, decreasing stress on component, thus decreasing component failures. This material provides high performance and proven reliability in high and low temperature cycling and thermal shcok. XK-S15 accommodates a variety of bond link thickness, filling intricate air voids and gaps.
Description
With the boom of Electric Vehicle Industry, the huge demand of thermal gap filler rose. GLPOLY may be the first one to launch thermal gap filler for EV battery pack applications.
GLPOLY predicted the great development of EV industry and imported fully-automatic production lines with prospective insight far beyond rivals.
Most of manufacturers still continued to use craft production, lots of bubbles would remain in materials in process, it was hard to monitor and control quality and appearance of finished products.
GLPOLY has powerful development and innovation ability, we would adjust the formula according to customers¡¯statement of requirements to meet their individualised requirements and finish adjustment in one week. GLPOLY was the only one that could promise this.
In May, 2018, a senior purchasing officer from a famous EV manufacturer contacted GLPOLY and enquired about EV battery pack thermal management materials. What he needed is more than full set of test report of product, like capacity of production, quality control and logistics plans etc. After customer reviewed full set of process, he requested XK-S20 thermal gap filler for test. After two years verification, customer recognised XK-S20 and built vendor code fo |
| Company: |
Shenzhen
|
| Contact: |
Mr. Oscar Lee |
| Address: |
Rm616-619 Huafeng xin'an Commercial Building ,Block 45 ,Bao'an District, Shenzhen,China |
| Postcode: |
518000 |
| Tel: |
8615989474551 |
| Fax: |
8675527579350 |
| E-mail: |
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