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Build Your Online Product Catalogs?
| Product Name: |
Thermal Gel K=4.0
|
| Supply Ability: |
9999999999999 |
| Related proudcts |
thermal gel, thermal gel k=4.0, thermal gels, |
| Specifications |
Thermal Gel K=4.0 |
| Price Term: |
FOB |
| Port of loading: |
Shenzhen /Hongkong |
| Minimum Order |
3000 |
| Unit Price: |
Negotiated |
|
Features
Thermal conductivity 4.0W/mK
Low thermal resistance
Ultra thin bondline
Conforming with wet out
Design for low stress application
Applications
Automotive electronics;
Comsumer electronics;
Telecommunications;
Computer and peripherals;
XK-G40 has a thermal conductivity of 4.0W/mK, providing high thermal performance. It requires no cureing and mixing, suitable for automated dipensing system. It deflects under very low compressive forces, decreasing stress on components.XK-G40 is designed to eliminate hand assembly time consuming, reducing installation cost.
Description
With the advancement of 5G technology, 5G infrastructures are deployed in any area. The 5G modules generate significant demend for thermal management solutions and thermal interface materials. Aiming to solve the thermal management challenges of 5G devices such as radio units, baseband units, servers and routers etc, GLPOLY has launched exceptional performance thermal gel XK-G40 in 2019.
GLPOLY XK-G40 thermal gel is a liquid gap filling material with 4.0W/mK thermal conductivity designed to improve thermal contact, decrease stress on component.
We used to apply thermal gap pad in thermal management, sometimes, there would be some problems. If a certain amount of compression is required, the compressive force may destroy the chip. How can we fix this problem?
A 5G telecom equipment consulted us about thermal management solution. they used a thermal gap pad with a thermal conductivity of 3.6W/mK, the performance is good enough when they tested the thermal pad, but heat dissipating is not as good as expected. The supplier told them the interface contact is not tight enough, and requested customer to place much more compressive forces. Finally, this resulted in destroy to chip.
As we learned about this application, we knew the strain was what it mattered. GLPOLY had designed a sort of thermal gel to fix problem like this. We recommended XK-G40 high performance thermal gel with a thermal condu |
| Company: |
Shenzhen
|
| Contact: |
Mr. Oscar Lee |
| Address: |
Rm616-619 Huafeng xin'an Commercial Building ,Block 45 ,Bao'an District, Shenzhen,China |
| Postcode: |
518000 |
| Tel: |
8615989474551 |
| Fax: |
8675527579350 |
| E-mail: |
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